TIF100-35-11UF High Conductive 3.5W Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element
Product descriptions
TIF®100-35-11UF thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.
Features
> Good thermal conductive : 3.5W/mK
> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application environments
> Available in different thickness options
Applications
> Heat dissipation structure for radiators
> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles
> LED TV and lamps
| Typical Properties of TIF®100-35-11UF Series |
| Color | Gray | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ******* |
| Density | 3.0g/cc | ASTM D297 |
| Thickness range | 0.02~0.20inch / 0.5~5.0mmT | ASTM C351 |
| Hardness | 75 Shore 00 | ASTM 2240 |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D412 |
| Operating Temp | -40 ~200℃ | ******* |
| Dielectric Constant | 4.0 MHz | ASTM D150 |
| Volume Resistivity | ≥1.0X10¹²Ohm-meter | ASTM D257 |
| Fire rating | 94 V0 | equivalent UL |
| Thermal conductivity | 3.5W/mK | ASTM D5470 |
Product Specifications
Standard Thickness:
0.02 to 0.20 (0.50 to 5.00 mm) with increments of 0.01 (0.25 mm).
Standard Size:
8"X16"(203 mm×406 mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment). DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
Notes: FG (Fiberglass)provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25 to 0.50 mm).
The TIF series is available in custom shapes and various forms.
For other thicknesses or moreinformation. please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
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TIF100-35-11UF High Conductive 3.5W Thermal Silicone Pad Cooling Gap Filler For CPU Premium Insulation Element Images
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