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VIETNAM ZIITEK TECHNOLOGY CO.,LTD Vietnam Ziitek Technology Company Limited
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TIF100-18-01US Thermal Gap Filler Pad Thermal Conductive Silicone Pad For Graphics Card Thermal Module

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TIF100-18-01US Thermal Gap Filler Pad Thermal Conductive Silicone Pad For Graphics Card Thermal Module

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Brand Name : Ziitek

Model Number : TIF100-18-01US

Certification : RoHS

Place of Origin : Vietnam

MOQ : 1000pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 24*13*12cm cartons

Products name : Thermal Gap Filler Pad Thermal Conductive Silicone Pad For Graphics Card Thermal Module

Hardness : 18 Shore 00

Color : Black

Flame rating : 94-V0

Specific Gravity : 2.5g/cc

Keywords : Thermal Gap Filler Pad

Thermal conductivity : 1.8W/mK

Materials : Ceramic filled silicone elastomer

Application : Graphics Card Thermal Module

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TIF100-18-01US Thermal Gap Filler Pad Thermal Conductive Silicone Pad For Graphics Card Thermal Module

  

Product descriptions

 

TlF100-18-01US Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

 

Features

> Good thermal conductivity: 1.8 W/mK

> Naturally tacky needing no further adhesive coating
> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance

 

Application

> Cooling components to thechassis of frame
> Set Top Box
> Car Battery & Power SupplyCharging Pile
> LED Tvi Lighting
> Graphics Card Thermal Module

> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board

Typical Properties of TIF100-18-01US Series
Property Value Test method
Color Black *****
Construction &Compostion Ceramic filled silicone elastomer *****
Specific Gravity 2.5g/cc ASTM D297
Outgassing(TML) 0.45% ASTM C351
Hardness 18 Shore 00 ASTM 2240
Continuos Use Temp -45 to 200℃ *****
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 4.5MHz ASTM D150
Volume Resistivity 1.0X1012 Ohm-meter ASTM D257
Flame rating 94 V0 UL E331100
Thermal conductivity 1.8W/m-K ASTM D5470

 

Standard Thicknesses

0.020-inch to 0.200-inch (0.5mm to 5.0mm)

 

Product Sizes:

8" x 16"(203mm x406mm)

Individual die cut shapesand and custom thickness can be supplied.

Please contact us for confirming

TIF100-18-01US Thermal Gap Filler Pad Thermal Conductive Silicone Pad For Graphics Card Thermal Module

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Ziitek Culture

 

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.


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