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TIF100-18-11U Silicone Thermally Conductive Gap Filler Pad Thermally Conductive Silicone Thermal Pad for High Temperature Application

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TIF100-18-11U Silicone Thermally Conductive Gap Filler Pad Thermally Conductive Silicone Thermal Pad for High Temperature Application

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Brand Name : Ziitek

Model Number : TIF100-18-11U

Certification : RoHS

Place of Origin : Vietnam

MOQ : 1000pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 24*13*12cm cartons

Products name : Silicone Thermally Conductive Gap Filler Pad Thermally Conductive Silicone Thermal Pad for High Temperature Application

Hardness : 27 Shore 00

Flame rating : 94-V0

Specific Gravity : 2.5g/cc

Keywords : Thermal Gap Filler Pad

Application : Laptops, LED,Car Battery

Thermal conductivity : 1.8W/mK

Materials : Ceramic filled silicone elastomer

Color : Gray

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TIF100-18-11U Silicone Thermally Conductive Gap Filler Pad Thermally Conductive Silicone Thermal Pad for High Temperature Application

  

Product descriptions

 

TlF100-18-11U thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

 

Features

> Good thermal conductivity: 1.8 W/mK

> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

 

Application

> Cooling components to thechassis of frame
> Set Top Box
> Car Battery & Power SupplyCharging Pile
> LED Tvi Lighting
> Graphics Card Thermal Module

Typical Properties of TIF100-18-11U Series
Property Value Test method
Color Gray *****
Construction &Compostion Ceramic filled silicone elastomer *****
Specific Gravity 2.5g/cc ASTM D297
Outgassing(TML) 0.55% ASTM C351
Hardness 27 Shore 00 ASTM 2240
Continuos Use Temp -45 to 200℃ *****
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 4.5MHz ASTM D150
Volume Resistivity 4.0X1012 Ohm-meter ASTM D257
Flame rating 94 V0 UL E331100
Thermal conductivity 1.8W/m-K ASTM D5470

 

Standard Thicknesses

0.020-inch to 0.200-inch (0.5mm to 5.0mm)

 

Product Sizes:

8" x 16"(203mm x406mm)

Individual die cut shapesand and custom thickness can be supplied.

Please contact us for confirming

TIF100-18-11U Silicone Thermally Conductive Gap Filler Pad Thermally Conductive Silicone Thermal Pad for High Temperature Application

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

 

Why Choose us ?

 

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.


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TIF100-18-11U Silicone Thermally Conductive Gap Filler Pad Thermally Conductive Silicone Thermal Pad for High Temperature Application Images

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